UVC LED
- 光学传感器/Optical Sensor
- 颜色传感器/Color Sensor
- 接近传感器/Proximity Sensor
- 紫外线指数传感器/UV Sensor
- 环境光传感器/Ambient Light Sensor
- 汽车光学传感器/Automotive Optical Sensor
- 心率血氧传感器/Heart Rate/Blood Oxygen Sensor
- 可见光LED/Visible LED
- 光耦/Photo Coupler, IGBT, SSR
- IGBT光耦/IGBT Gate Driver
- 高速光耦/High Speed Photocoupler
- 光耦晶体管/Phototransistor Output
- 可控硅光耦/Phototriac Output
- 达林顿光耦/Photodarlington Output
- 施密特触发器/Schmitt Trigger
- LED闪光灯/Flash LED
- 汽车LED/Automotive LED
- 紫外线LED/UV LED
- 红外线发射管/Infrared LED
- 红外线接收管/IR Detector,Silicon
- 光电开关/Photointerrupter
- 接收头/Infrared Receiver Module
- 光纤端子/Optic Fiber-Photo Link
新闻中心
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- 2020-10-09深紫外LED是怎么消毒的?
- 2020-09-14深紫外LED杀菌效果应该怎么评估
- 2020-09-07深紫外LED是什么和深紫外LED的作
- 2020-09-03深紫外LED的特点
联系我们
- 地址:中国广东省东莞市塘厦镇莲湖南路68号钜鸿电商产业园310
- 电话:0769-81775972
- 手机:13592705594
- 传真:0769-81775972
- 邮箱:lizhenhuafanglian@126.com
FL280-QSC1F20M001-120°
- 型号:FL280-QSC1F20M001-120°
- 品牌:光宝
- 波长:270~280nm
- 尺寸:3.7×3.7×1.5 (L×W×H) [单位:mm]
- 产品描述:FL280-QSC1F20M001-120°是光宝UVC紫外灯珠的一款节能的杀菌和医疗应用光源,将发光二极管的寿命和可靠性优势与传统光源的亮度相结合,其波长为270nm-290nm/中心波长280nm,FL280-QSC1F20M001-120°光宝280nm紫外线LED更详细参数及应用,欢迎联系光宝代理芳莲电子。
产品介绍
1.产品示意图 Mechanical Specifications and Materials
- 图纸单位: mm
- 封装:3737封装,外型尺寸:3.7×3.7×1.5 (L×W×H) [单位:mm]
- 封装材质:氮化铝陶瓷支架,平面透镜
- 封装芯片数量:1 pcs
- 除非另有说明,公差为±0.10 mm
- Unit: mm
- LED Package: 3737 packaged, with size 3.7×3.7×1.5 (L×W×H) [Unit : mm]
- Bracket material:Aluminum nitride ceramic
- Chip inside:1 pcs
- Tolerances unless otherwise mentioned are ± 0.10 mm
2.光电特征参数 Typical Optical-Electrical Characteristics(Ta = 25 ℃)
- 这些数值由光谱分析仪和积分球测量系统测量。公差如下:工作电压(Vf):±2%;光功率(P0):±10%;峰值波长(λp):±3.0 nm
- 虽然所有的LED都是由我们的设备进行测试,但根据测试设备的条件,某些值可能会略有不同。
- These values measured by Optical spectrum analyzer and integrating sphere measuring system. And tolerances are followings as below: Forward Voltage (Vf): ±2%, Radiant Flux (P0): ±10%, Peak Wavelength (λp): ±3.0 nm
- Although all LEDs are tested by our equipment, some values may vary slightly depending on the conditions of the test equipment.
3.光电参数图例 Electro-Optical Characteristics
4.回流焊接 Reflow soldering profile
注意:本产品SMT贴片时需要使用低温锡膏。
Alert: Low temperature solder paste is required for SMT process of this product.
- 回流焊接是在电路板上组装LED的推荐方法。 DUVTek不保证通过浸焊方法组装的LED的性能。
- 推荐的焊接条件(Sn42/Ag1.0/Bi57,SMIC L23-BLT5-T8F)
- Reflow soldering is the recommended method for assembling LEDs on a circuit board. DUVTek does not guarantee the performance of the LEDs assembled by the dip soldering method.
- Recommended soldering conditions (Sn42/Ag1.0/Bi57, SMIC L23-BLT5-T8F)
5.防潮封装注意事项 Moisture-Proof Package
- 在焊接过程中,SMD封装中的湿气可能蒸发并膨胀。
- 湿气会损坏深紫外LED的光学特性。
- The moisture in the SMD package may vaporize and expand during soldering.
- The moisture can damage the optical characteristics of the DUV-LEDs due to the encapsulation.